Applied Nanotech Upgrades CarbAl

Managing thermal-related issues have been a major problem for companies in the high powered electronics domain. Lack of temperature control can cause failure for electronics, which in turn results in more failures than all other contributors combined.

Applied Nanotech Holdings is a company that provides solution to this problem. The company offers CarbAl, which is a heat transfer material with a combination of low density, high thermal diffusivity, high thermal conductivity, and a low coefficient of thermal expansion (CTE). The product offers a material that exceeds the abilities of traditional passive thermal management materials.

Recently, the company announced that it has introduced the next generation of CarbAl, its award-winning passive thermal management material. The new CarbAl is lighter in weight and provides an improved performance. It has a density of 1.75 g/cm3 compared to 2.7 g/cm3 for aluminum and 8.9 g/cm3 for copper. Also, compared to 0.84 cm2/sec for aluminum and 1.12 cm2/sec for copper, CarbAl's thermal diffusivity is approximately 2.9 cm2/sec.

“Major electronic companies are looking for ways to eliminate heat while also reducing weight and cost,” said David Jiang, Ph.D., director of the Thermal Management Division at Applied Nanotech. “CarbAl sets a new standard for removing heat and eliminating hotspots quickly and affordably. It is lighter than aluminum, more affordable than copper, and is approximately three times better at diffusing heat.”

In 2011, the company received notification that its U.S. Patent No. 5,869,922, which was given in the U.S. in 1999, claiming specific Raman spectrum signatures for all carbon films that have superior electron emission properties, has been issued in Japan (Japanese Patents No. 4786471 and No. 4786031). In addition to the U.S., earlier, this patent was given in other areas of the world, including China, Korea, and Europe, the company stated.